HK Fulltime Technology Co., Ltd.

Hong Kong Future Technology Co., Ltd

HongKong
Limited Liability Company
100-499 employees

Hong Kong Future Science and Technology Co., Ltd. is a subsidiary of Shenzhen Future Science and Technology Co., Ltd., and Future Science and Technology specializes in the design of laser radar SPAD chips, and is a unicorn company poised for an IPO. Its headquarters is located in Shenzhen, China, and it is an integrated circuit design company, a national high-tech enterprise, and the Guangdong Province Human-Computer Interaction Sensor Engineering Technology Research Center. As of now, it has applied for 776 intellectual property rights and been authorized for 397, covering SPAD chips and laser radar fields. Future Science and Technology has created many world records: the world's first under-screen color temperature chip is exclusively mass-produced in a first-line mobile phone brand flagship; the 3D visual product has the largest shipment volume in the smart lock industry; and the LCD under-screen fingerprint chip is globally launched.

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Registration Information

BRN/Business Registration Number

Date of Establishment

Company Registered Address

71630529

2020-02-26

香港 九龍旺角彌敦道610號荷李活商業中心1318-19室

*BRN/Business Registration Number is an identifier only and is not for dialing

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Opening positions (4)

3 to 5 yrs


Master

$ *****

13-month salary, year-end bonus

5-day work week, overtime allowance

Insurance plan, medical plan

5 to 10 yrs


Bachelor

$ *****

16薪

No experience limit


Bachelor

$ *****

No experience limit


Bachelor

$ *****

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No experience limit


No degree required

$ *****

Paid on-the-job training provided

No relevant industry experience required

1 to 3 yrs


Higher Diploma or Associate Degree

$ *****

1 to 3 yrs


No degree required

$ *****

13-month salary, year-end bonus, generous remuneration

Flexible bonus, insurance plan, medical plan

Transportation allowance, dental plan

No experience limit


Diploma of Secondary School

$ *****

No prior experience required, fresh graduates or career changers welcome

Comprehensive onboarding training and one-on-one coaching provided

Hong Kong Realty

  • Active today

1 to 3 yrs


Higher Diploma or Associate Degree

$ *****

Entitled to double pay, marriage leave, paid sick leave

Generous annual leave arrangement

Secondary school education sufficient

Dongpeng

  • Active within 7 days

No experience limit


No degree required

$ *****

1 to 3 yrs


Diploma of Secondary School

$ *****

13-month salary

5-day work week

Bank holidays

1 to 3 yrs


Higher Diploma or Associate Degree

$ *****

Work on a flexible week schedule, enjoy birthday and bank holidays

Staff enjoy free meals

Medical plan provided

No experience limit


Diploma of Secondary School

$ *****

Generous commission plus base salary, monthly income can reach over $35,000

Comprehensive medical and life insurance

Professional on-the-job training, suitable for those without telecom experience

Hong Kong Broadband

  • Active within 3 days

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Device R&D Engineer

香港阜时科技有限公司·Electronics / Electrical Equipment
HK$ *****
Master
3 to 5 yrs exp
HK work permit required
5 days per week, Fixed

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Work benefits
Double Pay
Year-end bonus
Compassionate leave
Marriage leave
PRC holidays
Paid overtime
Insurance plan
Extra Medical Insurance

Job Description

This position can be based in the West Lake District of Nanshan District, Shenzhen.

Duties:

1. Responsible for the development of silicon-based single-photon avalanche diode (e.g. SPAD, SiPM) device process, structure and characterization methods;

2. Responsible for device and pixel-level process, electrical, optical simulation and modeling work, quantifying performance indicators;

3. Participate in experiment design, and improve and iterate device design;

4. Research advanced characterization techniques for devices and promote the implementation of characterization schemes;

5. Keep up with the latest photonic and electronic device technologies, participate in project pre-research;

Requirements:

1. Master's degree or above, with 3 to 5 years or above of CMOS SPAD/SiPM device or CIS device pixel design experience (with complete design and fabrication experience preferred);

2. Proficient in semiconductor device simulation tools such as TCAD, FDTD, etc.;

3. Proficient in using Python or MATLAB programming language for data processing;

4. Familiar with semiconductor physics, solid-state physics, CMOS semiconductor process, optoelectronic devices, microelectronics, optics, materials and other related professional basic knowledge;

5. English proficiency of level four or above, listening, reading and writing are fluent without difficulty;

6. Able to use Word, Excel, PPT, etc., office and drawing software fluently;

7. Enjoy communication, good at team work, strong sense of responsibility and subjective initiative;

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Languages
English
Mandarin
Skills
Electrical Installation
Electronics Engineering
Electrical Engineer

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Miss Li
HK Fulltime Technology Co., Ltd. · HR

Job Location

荷李活商業中心-Mong Kok, Yau Tsim Mong

旺角彌敦道610號

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Company Overview
Hong Kong Future Science and Technology Co., Ltd. is a subsidiary of Shenzhen Future Science and Technology Co., Ltd., and Future Science and Technology specializes in the design of laser radar SPAD chips, and is a unicorn company poised for an IPO. Its headquarters is located in Shenzhen, China, and it is an integrated circuit design company, a national high-tech enterprise, and the Guangdong Province Human-Computer Interaction Sensor Engineering Technology Research Center. As of now, it has applied for 776 intellectual property rights and been authorized for 397, covering SPAD chips and laser radar fields. Future Science and Technology has created many world records: the world's first under-screen color temperature chip is exclusively mass-produced in a first-line mobile phone brand flagship; the 3D visual product has the largest shipment volume in the smart lock industry; and the LCD under-screen fingerprint chip is globally launched.
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