Glass application expert job responsibilities:

1. Responsible for the application technology evaluation of glass substrate, glass core, and glass interposer (glass interposer), focusing on 2.5D/3D IC, Chiplet, HDI high-density glass bridge, and glass waveguide, and completing glass-based packaging solution selection, performance simulation, sample validation and failure analysis.

2. In-depth understanding of TGV (glass through vias), RDL re-wiring, TSV, hybrid bonding hybrid bonding process, evaluate the advantages and disadvantages of glass substrate and IC-substrate organic carrier board, complete the comparison of glass substrate and traditional packaging solutions, output technical route recommendations, and support AI chip and Chiplet heterogeneous integration development.

3. Lead glass substrate sample application validation: including electrical, thermal, stress warping, reliability assessment, identification of TGV through-hole metallization, RDL wiring, bonding interface, etc. Key technical bottlenecks, and collaborate with Japanese supply chain manufacturers to drive problem closure and iterative optimization.

4. Interface with local Japanese supply chain, track global glass-based advanced packaging front-end technologies, investigate the latest processes and samples of TGV, glass core substrate, high-density glass bridge, and glass waveguide, and output technical intelligence and evaluation reports.

5. Participate in technical pre-research and patent layout, promote the evolution of glass-based advanced packaging from prototype validation to engineering implementation.

Job Requirements

1. Education: Master's degree or above, majoring in microelectronics, semiconductor materials, packaging engineering, and inorganic non-metallic materials.

2. Work experience: More than 3 years of glass substrate/glass interlayer/TGV-related project experience.

3. Professional knowledge:

 Familiar with glass substrate, glass core, glass interposer, TGV, RDL, TSV, hybrid bonding, understand the 2.5D/3D IC, Chiplet, HDI high-density glass bridge, glass waveguide technology principle;

 Familiar with IC‑Substrate organic packaging substrate, able to compare the performance, cost, and reliability differences between glass substrates and organic substrates in advanced packaging scenarios;

 Master advanced packaging reliability evaluation, familiar with warpage, stress, TGV through-hole metallization, RDL wiring, and bonding interface failure analysis;

 Understand the application of glass waveguides and glass interlayers in CPO co-packaged optical and optical interconnect scenarios.

5. Language: Fluent English