Duties include:

1. Lead the design and optimization of silicon light or thin-film niobium pentoxide chip manufacturing process, focusing on lithography, etching, doping, thin-film deposition, etc. core processes, and formulate process parameters and operating procedures.

2. Responsible for improving production yield, building a yield monitoring system, analyzing process bottlenecks and failure modes in mass production, formulating and implementing optimization plans, and solving complex process problems.

3. Familiar with semiconductor manufacturing equipment operation and maintenance, guide the team to use equipment in a standardized manner, participate in equipment parameter tuning and technical upgrading, and ensure production stability.

5. Have the ability to guide assistant engineers, train process operation skills and problem-solving methods, and lead the team to quickly get started on mass production work.

6. Interface with the chip design team, provide process feasibility analysis and feedback, and ensure that the design solution is compatible with the manufacturing process.

Job Requirements

1. Bachelor's degree or above, majoring in Materials Science and Engineering, Semiconductor Physics, Microelectronics, etc., with a preference for Master's/Doctoral degrees.

2.5 years or more of silicon photonics or thin-film lithium niobate chip manufacturing process work experience, familiar with the entire wafer manufacturing process, those with 8-inch/12-inch wafer fab work experience are preferred.

3. Proficient in at least 1-2 core manufacturing processes, with the ability to optimize process parameters, improve yield, and solve complex process problems.

4. Familiar with semiconductor manufacturing equipment operation and maintenance, understand process design rules and quality control standards, and have process R&D and mass production conversion capabilities.

5. Have good cross-departmental communication and collaboration skills, and be able to effectively link design, quality, etc. teams to promote projects; have technical inheritance awareness, and be able to lead newcomers to grow.

6. Rigorous and detailed, result-oriented, with strong data analysis and stress resistance abilities, and continuous learning enthusiasm for semiconductor manufacturing processes.

Working location

Hong Kong / Hangzhou (optional), Hangzhou company name: Xi Li Optoelectronic Technology (Hangzhou) Co., Ltd.

Salary: This is a core position in the company, salary negotiable, and determined based on personal abilities!